发明名称 |
Vliesstoffmaterial, vorimpregniertes Material und ein Leiterplattensubstrat aus diesem Material |
摘要 |
The present invention provides a nonwoven fabric material prepared from short fibers (1) including thermal-resistant synthetic fibers bound with an inorganic binder (2), a prepreg and a circuit board using the same. The circuit board has an excellent dimensional stability even at a high temperature, and the circuit board is prevented from warping or being damaged by moisture absorption or the like. The inorganic binder (2) is a residue formed from a low melting point glass solution or a water-dispersible colloidal solution including at least either fibers or particles of low melting point glass dispersed therein. When the binder is used, a chemical covalent bonding by a siloxane bonding is formed. <IMAGE> |
申请公布号 |
DE60007572(D1) |
申请公布日期 |
2004.02.12 |
申请号 |
DE2000607572 |
申请日期 |
2000.02.17 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
ECHIGO, FUMIO;KAWAKITA, YOSHIHIRO |
分类号 |
B29C70/12;D04H1/552;D04H1/60;D21H13/20;D21H27/00;H05K1/03;H05K3/40 |
主分类号 |
B29C70/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|