| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plasma processing device which is efficiently set up and is shifted to another process, and is capable of preventing generation of particles from occurring. <P>SOLUTION: A semiconductor wafer mount 100 is equipped with a susceptor 153 of, for instance, AlN or the like and a dielectric member 180 formed of, for instance, SiO<SB>2</SB>or the like and is shaped so as to cover the entire susceptor 153. The dielectric member 180 is subjected to plasma processing for a certain time without mounting semiconductor wafer 1 so as to enable the plasma processing device to be efficiently set up, and shifted to another process, and to prevent generation of particles from occurring. <P>COPYRIGHT: (C)2004,JPO |
