| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of housing a plurality of semiconductor chips and chip parts in a package having a thickness equal to or smaller than that of a package housing a single semiconductor chip. <P>SOLUTION: The semiconductor device 100 is provided with a first die pad 1 down-set compared with the height of a boundary part 12; a first semiconductor chip 2 mounted on the first die pad 1; an electronic part 5 formed to be a thin-thickness chip mounted on a second die pad 4 obtained by increasing the width of at least one of a plurality of inner lead parts 3; metal threads 6; and leads 11. The die pads, the semiconductor chips, the inner lead parts and the metal threads are sealed with a resin sealer 8. <P>COPYRIGHT: (C)2004,JPO</p> |
