| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface treatment method of an organic film which is needed for forming a multi-layer of the thin films in the case the thin film is composed of a solvent-soluble organic material used as an insulating layer, concerning a process of manufacturing the multi-layer wiring used for a digital integrated circuit chip for high speed information processing and a mounting system such as a package, a module and a board for mounting the chip. SOLUTION: When a second layer is formed on a first layer to form the multi-layer of the thin film, in the case the thin film is formed by using a thin film forming method such as spin coating with the solvent-soluble organic material used as the insulating layer, the film thickness is considerably reduced from an assumed value when the thin film is formed because the first layer dissolves in the solvent in applying the second layer, and a film thickness distribution is extremely deteriorated. To overcome these problems, this surface treatment method modifies the surface of the first layer by irradiating the surface with a single or a plurality of particle rays or light such as plasma ions, electronic beams or Deep-UV to make the first layer insoluble in the solvent when the second layer is applied on the first layer so as to form the second layer. COPYRIGHT: (C)2004,JPO
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