| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a resin-sealed semiconductor device for solving a quantitative problem in a production process, improving the number of productions and production speed, and realizing the resin-sealed semiconductor device with high efficiency. <P>SOLUTION: Semiconductor chips 11 are loaded on a substrate 10 having a plurality of package units, and a plurality of package units are resin-sealed with continuously integrated sealing resin 13. The warped substrate 10 is stuck to a sheet 14 and it is cut at every package in such a state. Thus, it is cut and isolated into the respective resin-sealed semiconductor devices while the warpage of the substrate 10 is dissolved. Since the substrate can be cut into pieces while the caused warpage is dissolved, the manufacturing method of the highly reliable and highly efficient resin-sealed semiconductor device is realized as mass production technology of a collective forming method. <P>COPYRIGHT: (C)2004,JPO</p> |
