| 摘要 |
A method and a device for mounting: the method characterized by comprising the steps of forming an energy wave or energy particle flow area (9) in a clearance formed between objects to be bonded having metal connection parts (4) and (5) before bonding the objects to each other, cleaning the surfaces of the metal connection parts (4) and (5) of the objects substantially simultaneously by the flowing energy wave or the energy particles, and bonding to each other the metal connection parts (4) and (5) of both objects having the surfaces activated by cleaning, whereby, basically, a chamber becomes unnecessary, the use of a large amount of special gas also becomes unnecessary, the metal connection parts (4) and (5) can be activated by efficiently cleaning out the surfaces thereof, and a bonding at a room temperature or a low temperature becomes possible. |
