发明名称 |
APPARATUS FOR CLEANING WAFER |
摘要 |
PURPOSE: An apparatus for cleaning a wafer is provided to remove fully the remaining particles by injecting the cleaning solution on the surface of a rotating wafer. CONSTITUTION: An apparatus for cleaning a wafer includes a plurality of holders(250), the first plate(210), and the second plate(220). The holders(250) are used for gripping a circumference of a wafer and rotating the wafer. The first plate(210) is opposite to the first side of the wafer. The first plate(210) includes the first nozzles(212) to inject the first cleaning solution. The second plate(220) is opposite to the second side of the wafer. The second plate(220) includes the second nozzles(222) to inject the second cleaning solution.
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申请公布号 |
KR20040011829(A) |
申请公布日期 |
2004.02.11 |
申请号 |
KR20020044976 |
申请日期 |
2002.07.30 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, DONG HYEON;LEE, SANG HO |
分类号 |
H01L21/302;B08B3/02;H01L21/00;(IPC1-7):H01L21/302 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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