METHOD FOR FABRICATING BGA SEMICONDUCTOR PACKAGE USING FLEXIBLE CIRCUIT BOARD

摘要

PURPOSE: A method for fabricating a BGA(ball grid array) semiconductor package using a flexible circuit board is provided to easily separate a resin encapsulant from a carrier frame and prevent cracks from being generated on the outer circumference of the resin encapsulant by making the outer circumference of the resin encapsulant formed of multi tilted surfaces. CONSTITUTION: A carrier frame(80) having an opening(81) of a corresponding size to a circuit pattern(42) of a flexible circuit board(40) is attached to the flexible circuit board by interposing an adhesion layer(90). The opening of the carrier frame is formed of a tilted surface(81a) which is tilted in a direction from the upper part of the carrier frame to the lower outside of the carrier frame.