Imaging device

摘要

An imaging device such as a CMOS image sensor (200) has a cover (240) attached to a standoff (220) surrounding a micro-lens array (210). Standard wafer processing fabricates the standoff (220) (e.g., out of photoresist) and attaches the cover (240). The standoff (220) maintains a gap over the micro-lenses (130). An adhesive attaches the cover (240) to the standoff (220) and can be kept away from the micro-lenses (130) by a barrier (330) having a structure similar to the standoff (220). Particles in the adhesive can prevent the adhesive from squeezing out from between the cover (240) and the standoff (220) during attachment. The standoff (220) can provide a vent (522) to prevent pressure in the gap from causing distortion or damage. The shape of the vent (522) can prevent particles from entering the gap. Cutting the attached cover (240) exposes electrical connections and can use preformed grooves (720) in the cover (240) to allow cutting of the cover (240) without damaging underlying circuit elements.