| 摘要 |
PURPOSE: A semiconductor chip package for preventing damage of a bonding wire is provided to prevent the damage of the bonding wire by maintaining uniformly the flow of a liquefied molding material. CONSTITUTION: A semiconductor chip package for preventing damage of a bonding wire includes a semiconductor chip(200), a die pad(210), a plurality of inner leads(230), and a molding material. A plurality of bonding pads(204) are formed on an active region of the semiconductor chip(200). The semiconductor chip is adhered on the die pad(210). A plurality of tie bars(220) are formed on each of the die pad. The inner leads(230) are installed between the tie bars(220). The inner leads are electrically connected to the bonding pad(210) through a bonding wire(250). The molding material is used for sealing the semiconductor chip, the die pad, and the inner leads. |
