| 摘要 |
PURPOSE: A duplexer chip package and a fabricating method thereof are provided to simplify a structure by forming a duplexer circuit within one package. CONSTITUTION: A duplexer chip package includes the first and the second filters(21a,21b), a ground pattern(23), an inductor substrate(25), a capacitor substrate(26), a phase shifter substrate(27), and a ground substrate. The first and the second filters(21a,21b) are used for separating a transmitting signal and a receiving signal of a dual frequency band. The ground pattern(23) is used as a grounding portion for the first and the second filters(21a,21b). The inductor substrate(25) is formed on the ground pattern. The capacitor substrate(26) is formed at a bottom side of the inductor substrate by using a plurality of capacitors. The phase shifter substrate(27) is formed at the bottom side of the inductor substrate by an inductor used as a diplexer. The ground substrate is formed at a bottom of the phase shifter substrate. |
