| 摘要 |
<p>A buffer capable of integrally packaging multiple sheets of glass substrates having electronic components formed thereon,wherein a side wall(4)having a length of 30 to 100% ranging from the top to the end part of an L−shaped body(2)is formed on at least one side of the body(2)of L−shape in cross section by using an internal molded body formed with polyolefin resin foam particulates with specific physical properties,whereby the buffer can be used suitably for a packaging operation,particularly for automization,in a clean room,and also can be re−used.</p> |
