SOCKET DEVICE FOR TESTING SEMICONDUCTOR DEVICE TEST

摘要

PURPOSE: A socket device for testing a semiconductor device is provided to easily manufacture a back cover made of a resin material, thereby reducing the manufacturing cost of a test socket and a period for manufacturing the test socket. CONSTITUTION: A housing(410) has a plurality of through holes(411). A back cover(420) formed of the same resin material as the housing is coupled with a back surface of the housing and has a plurality of through holes(421). A plurality of probe pins(430) are contained in the plurality of through holes of the housing and the back cover for electrically connecting a semiconductor device(100) with a test board(300) to probe the semiconductor device. Each probe pin includes a plunger(440) to be electrically contacted with the semiconductor device, and a coil spring(450) inserted into a fixing part of the plunger to be electrically contacted with the test board.