METHOD AND APPARATUS FOR COOLING BAKE EQUIPMENT FOR SEMICONDUCTOR FABRICATION

摘要

PURPOSE: A method and an apparatus for cooling bake equipment for semiconductor fabrication are provided to perform rapidly a fabrication process by shortening a falling period of temperature. CONSTITUTION: The reference temperature value and the setup range of a heating plate are inputted. The temperature of an upper cover(30) and a lower supporter(32) including the heating plate is monitored. An over-heating state is decided by comparing the reference temperature value to a monitored temperature value. An inflow and outflow process of air is performed by operating a driving part if the monitored temperature value is larger than the reference temperature value. The upper cover(30) is decoupled or coupled from or to the lower supporter(32) to perform the inflow and outflow process. The operation of the driving part is stopped to perform a natural cooling process if the monitored temperature value corresponds to the setup range.