PURPOSE: A wafer labeling table is provided to prevent the damage of a wafer caused by dust which is adhered on the surface of the wafer labeling table by minimizing contact area between a wafer and the wafer labeling table. CONSTITUTION: A wafer labeling table includes a circular center table(101) and a peripheral table(103) formed around the circular center table(101). A vacuum groove(105) is formed at the boundary between the circular center table(101) and the peripheral table(103). A plurality of loading sides(111,112) are formed on the circular center table. A region between the loading sides(111,112) is dug as much as the predetermine depth from the loading sides(111,112). An anti-vacuum hole(115) is formed on the dug region between the loading sides.
