发明名称 Semiconductor assemblies, methods of forming structures over semiconductor substrates, and methods of forming transistors associated with semiconductor substrates
摘要 The invention encompasses semiconductor assemblies that include a semiconductor substrate having a first region and a second region defined therein. A first oxide region is on the substrate and covers the first region of the substrate. The first oxide region has nitrogen provided therein and substantially all of the nitrogen is at least 10 Å above the semiconductor substrate. A first conductive layer is over the first oxide region and defines a first transistor gate. First source/drain regions are proximate the first transistor gate and gatedly connected to one another by the first transistor gate. The second region is covered by a second oxide region. A second conductive layer is over the second oxide region and defines a second transistor gate. Second source/drain regions are proximate the second transistor gate and gatedly connected to one another by the second transistor gate.
申请公布号 US6690046(B2) 申请公布日期 2004.02.10
申请号 US20010993109 申请日期 2001.11.13
申请人 MICRON TECHNOLOGY, INC. 发明人 BEAMAN KEVIN L.;MOORE JOHN T.
分类号 H01L21/31;H01L21/336;H01L21/469;H01L21/8234;H01L21/8238;H01L21/8239;H01L21/8247;H01L27/105;H01L29/76;H01L29/94;H01L31/062;H01L31/113;H01L31/119;(IPC1-7):H01L29/76 主分类号 H01L21/31
代理机构 代理人
主权项
地址