发明名称 |
System and method for electroplating fine geometries |
摘要 |
An electroplating system is described which provides for the formation of a conductive layer on a workpiece. The current used to electroplate the workpiece is controlled by a controller. The rotation of the workpiece within a solution containing conductive material is controlled by a rotation controller. The current level and/or rotation of the workpiece is controlled in such a way that the non-uniform growth of large grains within the conductive film is minimized.
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申请公布号 |
US6689686(B2) |
申请公布日期 |
2004.02.10 |
申请号 |
US20020247000 |
申请日期 |
2002.09.19 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
GULDI RICHARD L.;HSU WEI-YUNG |
分类号 |
C25D5/18;C25D5/04;C25D7/00;C25D7/12;C25D21/12;H01L21/288;(IPC1-7):H01L21/44 |
主分类号 |
C25D5/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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