| 摘要 |
The wiring board 1 is provided with the first resin insulating layer 7, the first filled via 19 penetrating it and filled and formed by the plating, and the second conductor layer 29 formed by the plating on them. In them, the second conductor layer 29 comprises the first resin insulating layer 7, the electroless plating layer 33 formed on the first filled via 19, and the electrolytic plating layer 37 composed of plating particle of substantially uniform size, formed thereon.
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