发明名称 |
Process for fabricating ball grid array package for enhanced stress tolerance |
摘要 |
The thermomechanical stress sensitivity of ball grid array (BGA) solder connections is significantly reduced, when the solder connections solidify in column-like contours after the reflow process-a result achieved by using the solder material in tapered openings of a thick sheet-like elastic polymer adhered to the BGA substrate and selected for its characteristics of non-wettability to solder and volumetric shrinkage greater than solder.
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申请公布号 |
US6689678(B2) |
申请公布日期 |
2004.02.10 |
申请号 |
US20030370140 |
申请日期 |
2003.02.19 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
JAMES RICHARD D.;STARK LESLIE E. |
分类号 |
H01L23/498;H05K3/34;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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