发明名称 |
Parallel plate development with multiple holes in top plate for control of developer flow and pressure |
摘要 |
A system and method is provided for applying a developer to a photoresist material layer disposed on a semiconductor substrate. The developer system and method employ a developer plate having a plurality of a application apertures for dispensing developer and a plurality of exit apertures for allowing excess developer to be removed from between the developer plate and the photoresist material layer. Preferably, the developer plate has a bottom surface with a shape that is similar to the wafer. The developer plate is disposed above the wafer and substantially and/or completely surrounds the top surface of the wafer during application of the developer. A small gap is formed between the wafer and the bottom surface of the developer plate. The wafer and the developer plate form a parallel plate pair, such that the gap can be made small enough so that the developer fluid quickly fills the gap with excess developer exiting through the exit apertures.
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申请公布号 |
US6688784(B1) |
申请公布日期 |
2004.02.10 |
申请号 |
US20010974620 |
申请日期 |
2001.10.10 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
TEMPLETON MICHAEL K. |
分类号 |
G03D5/04;(IPC1-7):G03D5/04 |
主分类号 |
G03D5/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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