| 摘要 |
A cooling device for cooling one or more electrical and/or electronic components, also referred to as E-components. The cooling device includes at least one cooling body which is assigned to the E-component and which is connected to the same in a thermoconductive manner. According to this invention, it is possible to achieve an effective heat exchange and thus a high operating efficiency in such a system. Thus, according to this invention the cooling body is in thermoconductive contact with a granular, liquid or pasty filling material that is capable of conducting heat. The liquid or pasty material is retained at least in areas by a flexible membrane, and the membrane is connected to a surface of the E-component.
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