| 摘要 |
PURPOSE:To provide a circuit board which can join a bonding wire and a circuit conductor firmly and quickly when directly mounting an active element such as a semiconductor element on the circuit board without any package. CONSTITUTION:A wiring conductor 2 consisting of high melt-point metal made of tungsten, molybdenum, manganese, etc., is formed inside and on the surface of an insulation board 1 such as ceramic and further a circuit conductor 4 consisting of copper is deposited so that the surface of the exposed wiring conductor 2 is covered. A bonding pad 2a is formed at a part which is exposed on the outer surface of the insulation board 1, a covering layer 5 which mainly consists of nickel with a Vickers hardness of 600 or larger is deposited on the surface of the bonding pad 2a, and a bonding wire which is connected from the area on the covering layer 5 to each electrode of the semiconductor element A. |
