发明名称
摘要 PROBLEM TO BE SOLVED: To prevent operation of an electronic component which is accommodated within a package, due to noise. SOLUTION: The package for electronic component accommodation includes a base 2 having a mount A for carrying thereon an electronic component 4 and having signal, ground and power lines 5a, 5b and 5c electrically connected to signal, ground and power electrodes of the electronic component 4 thereon or therein, and also includes a lid member 3 having a recess B for accommodating the component 4 mounted on the mount A therein. By mounting the lid 3 on the base 2 with sealing material provided therebetween, the component 4 is accommodated airtightly within the package. The ground line 5b has at least one branched auxiliary ground line 5d, the signal line 5a is surrounded by the ground and auxiliary ground lines 5b and 5d, at least part of the auxiliary ground line 5d contains magnetic particles, a metal layer 9 having a plurality of triangular prism-like projections 10 arranged thereon is applied on an internal wall of the recess B of the lid 3, and the metal layer 9 is electrically connected to the ground or auxiliary ground line 5b or 5d of the base 2.
申请公布号 JP3495245(B2) 申请公布日期 2004.02.09
申请号 JP19980032819 申请日期 1998.02.16
申请人 发明人
分类号 H05K9/00;H01L23/00;H01L23/02;H01L23/04;H01L23/12;H01L23/14;H01L23/552 主分类号 H05K9/00
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