| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating apparatus which does not require to monitor a liquid composition and accessory equipment therefor, and reduces the cost, and to provide a plating method. SOLUTION: The electrolytic plating apparatus 10 has a substrate treatment region 20 for contacting the surface to be plated of a substrate with a plating solution, and plating it therein. The substrate treatment region 20 is provided with an inflow part 100 for receiving a plating liquid to be used for plating therethrough, and an outflow part 120 for draining the plating liquid used for the plating process therethrough. The apparatus has such a structure as not to return the plating liquid drained from the outflow part 100 to the substrate treatment region 20. Then, the apparatus does not require to monitor the liquid composition, because of having such a structure so as not to use a plating liquid once used at all. COPYRIGHT: (C)2004,JPO
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