发明名称 |
Via connector and method of making same |
摘要 |
An insulator substrate or printed circuit board (PCB) having a filled and plated via. A sidewall of the via and preferably opposite sides of the insulator substrate are first plated with a conductive material. The plated via is then filled with an electrically conductive fill composition. A conductive cap layer is preferably formed over both ends of the conductive fill composition and the opposite surfaces of the insulator substrate, and can be bonded to a surface mount contact as a land or a pad.
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申请公布号 |
US2004020690(A1) |
申请公布日期 |
2004.02.05 |
申请号 |
US20030632576 |
申请日期 |
2003.07.28 |
申请人 |
PARKER JOHN LEROY;MISCIKOWSKI PAMELA L. |
发明人 |
PARKER JOHN LEROY;MISCIKOWSKI PAMELA L. |
分类号 |
H05K1/11;H05K3/00;H05K3/24;H05K3/40;H05K3/42;(IPC1-7):H05K3/02;H05K1/03;H01R12/04 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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