SEMICONDUCTOR MODULE AND POWER CONVERTER

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor module which can enhance the cooling performance and a reliable, small-sized and low-cost power converter which can keep its motion normally even if used under severe environment of heat cycles.

SOLUTION: A block member 14 is bonded on the opposite side from semiconductor chip 11 side of insulating boards 12 and 13 bonded severally to both sides of the semiconductor chip 11, and is bonded with a block member 15 astride the stack of the semiconductor chip 11 and the insulating boards 12 and 13.

COPYRIGHT: (C)2004,JPO