| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable an electronic component in an SD card to be more large. <P>SOLUTION: An SD card device comprises following constitution. A substrate 4 is attached to a plate-like part 3a opposite to a plate-like part 2a formed with an opening 7. A BGA substrate 11 is mounted on the substrate 4. A contact part 6 is formed on the surface of the BGA substrate 11 to be opposite to the opening 7. The contact part 6 and an electronic circuit 12 mounted on the substrate 4 are electrically connected through the BGA substrate 11. <P>COPYRIGHT: (C)2004,JPO |
