| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thin lead frame with a size of die island for packaging a semiconductor increased and a predetermined step between the island and inner lead provided, and to provide a method for manufacturing the lead frame capable of manufacturing the lead frame having the above structure. <P>SOLUTION: The lead frame has a die island and an inner lead arranged facing to the die island, and at least one side of the die island and each opposed side of the inner lead are approximately identical in plane pattern vision. Chamfering part for widening an interval between the opposed sides of each opposed side of at least either die island or inner lead in the lead fram having the predetermined step between the bottom face of the die island and the bottom face of the inner lead are arranged. <P>COPYRIGHT: (C)2004,JPO</p> |
