COMPONENT FORMATION BY PLATING TECHNIQUE

摘要

PROBLEM TO BE SOLVED: To form a conductive feature by a plating technique. SOLUTION: A plated terminal is guided and fixed by an internal electrode tab and additional anchor tab of exposed various types of widths. Such an anchor tab becomes a nucleus of an additional plating material by disposing the tab in or out of a chip structure. A substantially disc-like plating material is formed by exposing a combination of the electrode tab and the anchor tab in respective constitutions. Such a plating material finally forms a substantially spherical ball limiting metallized part by allowing a solder ball to reflow. In the formation of the self-determining plated terminal and the conductive component, different types of plating techniques and materials can be adopted. COPYRIGHT: (C)2004,JPO