| 摘要 |
A semiconductor device is provided having a terminal base (N1) electrically connected to a conductive foil pattern (201) and a terminal base (N2) electrically connected to switching elements (T1, T2, T3). The control electrodes of the switching elements (T1, T2, T3) are electrically connected to resistors (R10, R20, R30) with wire lines (WL). By using resistors to which the wire lines can be directly bonded, a size-reduced semiconductor device is attained. <IMAGE> |
