发明名称 |
MULTI-PHASE INVERTER MODULE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multi-phase inverter module having the excellent cooling characteristic of a built-in semiconductor element by improving electromagnetic wave noise shielding performance while suppressive an increase in cost. <P>SOLUTION: In the multi-phase inverter module in the two-story structure of a power semiconductor element 24 and a wiring board 27, electromagnetic wave noise is effectively shielded to provide the excellent heat radiation of a wiring board 27 through by the utilization of the excellent electrical conductivity and excellent thermal conductivity of a side wall 213, by providing the side wall 213 totally surrounding the power semiconductor element 24 to a metal member 21 for a cooling element formed as a so-called heat sink. <P>COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2004039749(A) |
申请公布日期 |
2004.02.05 |
申请号 |
JP20020192424 |
申请日期 |
2002.07.01 |
申请人 |
DENSO CORP;TOYOTA MOTOR CORP;TOYOTA INDUSTRIES CORP |
发明人 |
TORII TAKASHI;NAKAMURA MASASHI;YAMADA KOJI |
分类号 |
H01L25/07;H01L25/18;H02M7/48 |
主分类号 |
H01L25/07 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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