| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for repairing a part packaging substrate lessening inferior substrates produced due to soldering inferiority of the substrates and packaging inferiority of parts to the minimum in a part packaging process, and to provide a device, a program and a production system for repairing the part packaging substrate. <P>SOLUTION: In the part packaging substrate packaging parts on the soldered and printed substrate, the method inspects presence of the parts at a mounted position of the parts, whether the parts are regular or not, and the presence of shift of the packaged position of the parts. As the result, the method removes the mounting parts of the inferior package where the parts are detected as defective, inspects soldering quality at the mounted position of non-packaging without any part, and soldering quality at the mounted position where the defective parts are removed, and repairs soldering determined inferiority. <P>COPYRIGHT: (C)2004,JPO |
