| 摘要 |
PROBLEM TO BE SOLVED: To provide the structure of the miniaturized semiconductor package, has high dimensional accuracy and does not rise a manufacturing cost, and its manufacturing method, regarding a semiconductor package which is characterized by chip coat resin and the structure of a shield housing provided for protecting a semiconductor chip. SOLUTION: A step cut 15 is formed in an edge of chip coat resin 7 protecting a semiconductor chip 3 mounted on a substrate 1, and a shield housing 8 is positioned and fixed in a height direction by means of a step face 16 of the step cut. After the chip coat resin 7 for protecting the semiconductor chip 3 is charged and hardened, a groove 14 is cut and formed by a tool 13 of a prescribed width in a marginal part of the chip coat resin, and thereafter the shield housing 8 is fixed with a peripheral edge 8a in contact with the bottom of the groove. COPYRIGHT: (C)2004,JPO |
