| 摘要 |
PROBLEM TO BE SOLVED: To increase a degree of freedom in design, to increase wiring density, and to shorten a production lead time. SOLUTION: A resin board 1 having copper foils 2 and 3 on both faces is formed with a hole 4. Silver paste 5 which is produced such that silver particles formed with radial protrusions are mixed and dispersed in a binder formed of epoxy resin fills in the hole 4 and then is temporarily cured. On the copper foils 2 and 3 and the silver paste 5, copper plating films 6 are formed. The copper foils 2 and 3 and the copper plating film 6 are selectively etched to form an interconnection layer 7, thus forming a wiring base material 8. A second resin plate 11 is pasted with dry films on both faces, and is formed with a hole 15. A silver paste 16 is applied in the hole 15 and then is temporarily cured. Then, the dry films are removed, thus forming a connection base material 17. The wiring base materials 8 and the connection base materials 17 are alternately stacked, and a stacked body of the wiring base materials 8 and connection base materials 17 is pressurized and heated from both sides for thermocompression-bonding the wiring base materials 8 and the connection base materials 17. COPYRIGHT: (C)2004,JPO |
