| 摘要 |
PROBLEM TO BE SOLVED: To provide an etching method to form an outer shape and a groove of an object to be formed such as a quartz substrate that reduces the number of etching times applied to the object to be formed. SOLUTION: In the case of forming a tuning fork quartz wafer 1A provided with grooves 11c, 12c in the middle of a principal face by applying etching processing to the quartz substrate 2, only a Cr film 31 exists in parts corresponding to the grooves 11c, 12c, and two layers of the Cr film 31 and an Au film 32 exist at parts being other regions than the part corresponding to the grooves 11c, 12c and a part to be the tuning fork quartz wafer. After start of 'outer shape etching operation' and the Cr film 31 existing in a form of a single layer is molten and removed, a 'groove etching operation' and the 'groove etching operation' are processed in parallel. COPYRIGHT: (C)2004,JPO
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