| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board connection material where etching in a transport direction of a wiring board is made uniform and to provide a manufacturing method of the wiring board by using the material. SOLUTION: The wiring board connection material is composed of bridging/curing-type resin which can be dissolved or swelled by alkaline peeling solution after optical curing and can be peeled off. When etching is performed in an etching device where the board is transported in a horizontal direction by a transport means, a plurality of the boards are connected by the wiring board connection material, and the boards are integrated and are etched. Then, the wiring board connection material is removed by alkaline peeling solution. COPYRIGHT: (C)2004,JPO
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