发明名称 Maskless middle-of-line liner deposition
摘要 A process for fabricating a semiconductor structure, wherein the semiconductor structure includes a core region and a periphery region. The core region includes a plurality of transistors and the periphery region includes a plurality of transistors. The process includes depositing a middle-of-line liner using plasma enhanced chemical vapor deposition overlying the semiconductor structure. By using a plasma enhanced chemical vapor deposition the amount of MOL liner deposited in the core region and the periphery region can be controlled depending on the distances between transistors in the core region and periphery region.
申请公布号 US2004021154(A1) 申请公布日期 2004.02.05
申请号 US20020210132 申请日期 2002.07.31
申请人 INFINEON TECHNOLOGIES NORTH AMERICA CORP. 发明人 MALDEI MICHAEL;LEE JINHWAN;GERSTMEIER GUENTER;COUSINEAU BRIAN;BERRY JON S.;BAKER STEVEN M.;HEDGE MALATI
分类号 H01L21/318;H01L21/8239;H01L21/8242;H01L27/105;H01L27/148;H01L29/76;(IPC1-7):H01L27/148 主分类号 H01L21/318
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