发明名称 SOLID-STATE IMAGING DEVICE
摘要 PURPOSE: To provide a sold-state imaging device which has no inconvenience such as variations in color and intercolor breeding between adjacent pixels. CONSTITUTION: A metal interconnection layer 2, a plurality of metal plugs 3, metal interconnection layer 4, a plurality of metal plugs 5, metal interconnection layer 6, a plurality of metal plugs 7, and metal interconnection layer 8 are so formed as to enclose a space located vertically on a principal plane of a semiconductor substrate 10 of a photoelectric transfer element 1. These metal sections constitute an optical waveguide, which prevents the leakage of incident light into other photoelectric transfer elements by reflecting the incident light from outside.
申请公布号 KR20040011343(A) 申请公布日期 2004.02.05
申请号 KR20030021561 申请日期 2003.04.07
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA;RYODEN SEMICONDUCTOR SYSTEM ENGINEERING CORPORATION 发明人 KUBOTA MUTSUMI;KIMURA MASATOSHI
分类号 H01L27/14;H01L27/146;H01L27/148;H04N5/335;(IPC1-7):H01L27/146 主分类号 H01L27/14
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