| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad for chemomechanical polishing having recesses of a prescribed form on the polishing surface side to be capable of restricting generation of scratches in a subject surface. <P>SOLUTION: This polishing pad has a plurality of recesses or through holes on the polishing surface side, and surface roughness of the inner surfaces of the recesses, etc., is 20μm or less, or especially 10μm or less. For the recesses, etc., depth is 0.1 mm or more, or especially 0.1-2.5 mm, minimum size in a plane direction is 0.1 mm or more, or especially 0.1-5 mm, and minimum distance between adjacent recesses, etc., is 0.05 mm or more, or especially 0.05-100 mm, preferably. In addition, preferably, the polishing pad comprises non-water-soluble matrix including crosslinking 1, 2-polybutadiene resin, etc., and water-soluble grains of polysaccharides dispersed in the matrix, more preferably. The polishing pad can be a multi-layer polishing pad having a flexible support layer of resin foam material or the like on the reverse side. <P>COPYRIGHT: (C)2004,JPO |
