| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit board and its manufacturing method capable of reducing the number of circuit parts and a mounting cost by containing a capacitor in the circuit board, and improving mounting density by miniaturizing and flattening the contained capacitor. <P>SOLUTION: A capacitor structural section 1 comprises a first electrode 2 formed by plating copper and the like, a second electrode 3 formed by processing a second conductive layer located on the second surface of a double-side copper-clad sheet, and a dielectric layer 4 composed of a part of an insulating base 5 interposed between both electrodes 2, 3. The circuit board includes a conductive layer 6 on which required wiring is formed including the lower surface of the first electrode 2. Further, a via hole 7 can be also formed, and instead of a means to form the dielectric layer 4 composed of a part of the insulating base 5, the circuit board can be constituted of a dielectric layer 8 composed of separate electrolytic deposition resin. <P>COPYRIGHT: (C)2004,JPO</p> |
