发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF ENVELOPING AN INTEGRATED CIRCUIT |
摘要 |
A package of a semiconductor device comprising an integrated circuit (10) generally comprises an inner layer (21) and an outer layer (16), which layers (16,21) have a mutual interface (24). An improved stability of the package is realized in that the interface (24) encloses a delamination area (22), which area (22) is isolated from any bond pads (18) of the integrated circuit (10). The delamination area (22) may be created by a pattern-wise activation of a surface of the inner layer (21). A quantity of a curable polymer may be disposed on this surface to achieve this. |
申请公布号 |
WO03044858(A3) |
申请公布日期 |
2004.02.05 |
申请号 |
WO2002IB04942 |
申请日期 |
2002.11.20 |
申请人 |
KONINKLIJKE PHILIPS ELECTRONICS N.V.;WIJDENES, JACOB |
发明人 |
WIJDENES, JACOB |
分类号 |
H01L23/29;H01L21/56;H01L23/31 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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