METHOD AND SYSTEM FOR LOCALLY CONNECTING MICROSTRUCTURES
摘要
A method and system for locally connecting microstructures and devices formed thereby are provided wherein localized solder-bonding creates bonds between pairs of microstructures found on miniature flexible cables and silicon microsystems platforms. Multi-lead contact to the pads are detected automatically, triggering an embedded heater or heaters to initiate solder melting. This approach enables delicate microstructures to be connected and disconnected from microsystem platforms in the field, and is implemented with a process that is compatible with monolithic integration of circuits.
申请公布号
WO03062136(A3)
申请公布日期
2004.02.05
申请号
WO2003US01628
申请日期
2003.01.17
申请人
THE REGENTS OF THE UNIVERSITY OF MICHIGAN;LEMMERHIRT, DAVID, F.;WISE, KENSALL, D.