| 摘要 |
PROBLEM TO BE SOLVED: To reduce linear factors with respect to an airflow path for sucking a substrate. SOLUTION: A substrate holding device A has such an arrangement that grooves 11 are formed in a plane 10 of an suction pad 1 for mounting the substrate B, and that the substrate B is sucked with the suction of air through the grooves 11. The grooves 11 are constituted of an endless groove 11b and a plurality of ended curved grooves 11a, with one end of each of which being coupled to the endless groove 11b and radially formed therefrom. COPYRIGHT: (C)2004,JPO |
