SEMICONDUCTOR POWER MODULE

摘要

PROBLEM TO BE SOLVED: To provide a small and low cost semiconductor power module having a high withstand voltage. SOLUTION: A distance (creepage distance for insulation) L from an external terminal 16 to an external heat sink 15 along the surface of a molding resin 14 is made longer than a gap D, by providing a groove concave on the backside of the molding resin 14 or a projection part on the molding resin 14. Therefore, a long effective insulation interval between the external heatsink 15 and the external terminal 16 provides a small and low cost semiconductor power module having the high withstand voltage. COPYRIGHT: (C)2004,JPO