| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat conduction sheet (spacer) as a heat conduction means that can contain a heat conduction means for conducting heat from a heat evolving electronic component to a heat sink in a circuit device having a electronic circuit including the electronic component, thereby remarkably reducing a period of time and accordingly reducing a cost to manufacture the circuit deice as a whole. SOLUTION: In a heat conduction spacer (1) placed between one or a plurality of heat evolving electronic components and a heat sink mounted on a substrate, a plurality of heat conduction sheets (3a, 3b, 3c, and 3d) each having a specified shape and thickness and to be contacted closely with the heat evolving electronic component are integrally mounted on the predetermined position of an electrically insulated sheet (2). COPYRIGHT: (C)2004,JPO |
