| 摘要 |
PROBLEM TO BE SOLVED: To prevent the occurrence of an abnormal release when a substrate is released from an electrostatic chuck provided in a treatment apparatus and to shorten a time required for the release. SOLUTION: The wafer placing surface of the electrostatic chuck 4 is formed in a recess curved surface state, and a wafer W is attracted and held along the placing surface. The curved surface is formed in such a manner that, when a voltage to a chuck electrode 41 is stopped, a residual attracting force generated between the wafer W and the chuck 4 becomes larger than a restoring force tending to restore the wafer W. After the attraction of the wafer W is released, when the wafer W is pressed by a support pin 63 and reset to an original state, a gap is formed between the wafer W and the pin 63, and thereby an electrostatic capacity between the wafer W and the chuck 4 is reduced. Thus, residual charge existing between the wafer W and the chuck 4 is moved toward the peripheral edge region of the wafer F, is released to a ground through a ring member 5 and accordingly can be rapidly destaticized. COPYRIGHT: (C)2004,JPO |
