| 摘要 |
PROBLEM TO BE SOLVED: To provide a build-up multiplayer printed circuit board that excels in surface smoothness by filling paste-form filling materials in through holes without including bubbles. SOLUTION: After through holes are provided in a substrate, plated conductors are formed in the inner wall of the through holes, and it becomes the board with through holes and internal layer circuits. After filling materials are filled in the through holes, interlayer resin dielectric layers are formed on both sides of the board. COPYRIGHT: (C)2004,JPO |
