发明名称 |
FORMATION STRUCTURE OF POSITIONING MARK FOR MOUNTING ELECTRONIC COMPONENT ON FLEXIBLE WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide a formation structure of a positioning mark for electronic components on a flexible wiring board capable of accurately mounting the electronic components on the flexible wiring board by correctly recognizing the positioning mark at a low cost with a simple structure. SOLUTION: The positioning mark 10 for forming a soldering pattern on an electrode pattern and for mounting the electronic coponents on one substrate surface 9a is formed on the other substrate surface 9b facing the one substrate surface 9a, and a surface 10a on the substrate surface side of the positioning mark 10 is formed in a black color. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2004039702(A) |
申请公布日期 |
2004.02.05 |
申请号 |
JP20020191509 |
申请日期 |
2002.06.28 |
申请人 |
OPTREX CORP;HIROSHIMA OPT CORP |
发明人 |
MIKOYAMA MASAKI;SUNADA TOMOMASA |
分类号 |
H05K1/02;H01L21/60;(IPC1-7):H01L21/60 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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