发明名称 FORMATION STRUCTURE OF POSITIONING MARK FOR MOUNTING ELECTRONIC COMPONENT ON FLEXIBLE WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a formation structure of a positioning mark for electronic components on a flexible wiring board capable of accurately mounting the electronic components on the flexible wiring board by correctly recognizing the positioning mark at a low cost with a simple structure. SOLUTION: The positioning mark 10 for forming a soldering pattern on an electrode pattern and for mounting the electronic coponents on one substrate surface 9a is formed on the other substrate surface 9b facing the one substrate surface 9a, and a surface 10a on the substrate surface side of the positioning mark 10 is formed in a black color. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004039702(A) 申请公布日期 2004.02.05
申请号 JP20020191509 申请日期 2002.06.28
申请人 OPTREX CORP;HIROSHIMA OPT CORP 发明人 MIKOYAMA MASAKI;SUNADA TOMOMASA
分类号 H05K1/02;H01L21/60;(IPC1-7):H01L21/60 主分类号 H05K1/02
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