发明名称 |
Advanced chemical mechanical polishing system with smart endpoint detection |
摘要 |
An apparatus for polishing a workpiece includes a workpiece holder configured to hold the workpiece, a polishing member configured to be positioned adjacent to a face of the workpiece in order to polish the workpiece face with a front side of the polishing member, and a platen having a plurality of pressure zones configured to selectively apply pressure to the polishing member thereby causing the polishing member to contact the workpiece face with selective pressure. In another embodiment, the apparatus includes a pressure controller coupled to the platen and configured to selectively adjust the pressure zones.
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申请公布号 |
US2004023606(A1) |
申请公布日期 |
2004.02.05 |
申请号 |
US20030346425 |
申请日期 |
2003.01.17 |
申请人 |
WANG YUCHUN;FREY BERNARD M.;BASOL BULENT M.;TALIEH HOMAYOUN;YOUNG DOUGLAS W.;MCGRATH BRETT E.;DESAI MUKESH;VELAZQUEZ EFRAIN;TRUONG TUAN |
发明人 |
WANG YUCHUN;FREY BERNARD M.;BASOL BULENT M.;TALIEH HOMAYOUN;YOUNG DOUGLAS W.;MCGRATH BRETT E.;DESAI MUKESH;VELAZQUEZ EFRAIN;TRUONG TUAN |
分类号 |
B24B21/04;B24B21/08;B24B37/04;B24B49/10;B24B49/16;(IPC1-7):B24B21/00 |
主分类号 |
B24B21/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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