GROOVE GRINDING BLADE, AND METHOD FOR MACHINING TIE BAR CUTTER USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a method for machining to minimize groove width difference for a cutting edge of a cutter to cut a tie bar of an IC package. SOLUTION: This device comprises a groove grinding diamond blade 3 having a thickness of 0.10-0.50 mm in a rotation axial direction of a grinding wheel member 3b, with one side surface of the grinding wheel member forming a perpendicular surface to an outer circumferential surface of the grinding wheel member, and the other side surface having an inclination of 80.0-89.7 deg. to the outer circumferential surface of the grinding wheel member toward a blade rotation axial direction. A cemented chip 2 on a work table 6 is cut to form a pre-groove of a width L1narrower than a desired groove width Le. The groove grinding diamond blade is then retracted from the cemented chip 2, and the groove grinding diamond blade is moved till the perpendicular side surface of the grinding wheel member in the blade is off the pre-groove by a width Le-L1. The pre-groove in the cemented chip is then cut with the groove grinding diamond blade 3 that is rotating to machine the groove to have the desired groove width Le. COPYRIGHT: (C)2004,JPO